Shapes LD 2800

 

 



Technical Specifications  
 
LD 2800
Maximum use limit °C
°C 1538
Maximum use limit °F
°F 2800
Continuous use limit
°C 1426
Continuous use limit
°F 2600
Melting Point     
 
°C 1850
 
°F 3362
Density (lbs/ft.3)     
 
14-18
Thermal Shrinkage (%)
24 hours @ 2200 °F
1-2
Thermal Conductivity (Btu in/hr ft2 °F)  
316°C (600 °F)
0.5
538°C (1000 °F)
0.6
760°C (1400 °F)
0.8
1094°C (2000 °F)
1.2
Chemical Analysis (%)  
AL2O3
63-65
SiO2
32-34
Others
1-2




Dimensiones Estandar
Width: 305 & 610 mm (12" & 24" )
Length: 914 & 1219 mm (36" & 48")
Thickness: 13, 19, 25, 38, 50, 64 & 76 mm
(1/2", 3/4", 1", 1 1/2", 2", 2 1/2" & 3")

 

Organic materials pres
ented in the board will burn out at about 150°C, once these materials have burned out there will be little or no further out gassing.

All data represents typical results of standard tests conducted under controlled conditions. As such the information is intended only as a general guide for specifications and design estimates.

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