Board LD 2800

 

 


Technical Specifications    
 
LD
2800
Maximum use Limit°C
1538
Maximum use Limit°F
2800
       
Use Temperature °C
1426
Use Temperature °F
2600
       
Melting Point °C
1850
Melting Point °F
3362
Density (lbs/ft3)
14-18
Thermal Shrinkage (%)      
24 Hrs @ 2200 °F
1-2
Thermal Conductivity
btu in/hr ft2 °F
     
316°C (600 °F)
0.5
538°C (1000 °F)
0.6
760°C (1400 °F)
0.8
1094°C (2000 °F)
1.2
Chemical Analysis(%)      
AL2O3
63-65
SiO2
32-34
Otros
1-2

Board Dimensions:
Thickness: 305 & 610 mm (12" & 24" )
Width: 914 & 1219 mm (36" & 48")
Length: 13, 19, 25, 38, 50, 64 & 76 mm
(1/2", 3/4", 1", 1 1/2", 2", 2 1/2" & 3")

Organic materials presented in the board will burn out at about 150°C, once these materials have burned out there will be little or no further out gassing.

All data represents typical results of standard tests conducted under controlled conditions. As such the information is intended only as a general guide for specifications and design estimates.



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